Siyao Completes Internship at TE Connectivity

Siyao Wang spent twelve weeks this summer in Fremont, California working with TE Connectivity. TE is a technology company that develops sensors and connectivity components suitable for use in harsh environments. Siyao worked in the Printed Electronics Group of Corporate Technology, where she was responsible for developing formulations of conductive inks and characterizing the associated functional materials. She investigated the surface and interfacial properties, such as wetting and adhesion, of relevant materials. She also assisted in the development of scalable printing processes and fabrication of several prototype devices.

Overall, she had a great experience with the team at TE that broadened her research capabilities. Great work Siyao, and we’re glad to have you back!